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Modular system of the i-PAN HMIs
The i-PAN M7, T7 and T10 touchpanel systems are modular designed. The individual components are available separately or as assembly units and serve as a basis for integration in customer-specific units. The i-PAN XT-Pro 10 is a ready-to-install touchpanel solution and the front is splash water and dust protected according to protection class IP 65.
The i-PAN M7 CoverLens is based on Myon SOM with Qualcomm Snapdragon 410E processor and is available with Microsoft Windows 10 IoT Core, Linux or Android operating systems. i-PAN T7 and T10 CoverLens as well as i-PAN XT-Pro 10 are based on Trizeps SODIMM 200 CPU modules. They are available with Windows Embedded Compact 7 or 2013, Linux and Android operating systems. Depending on the i-PAN version they are equipped with 10.1 or 7.0 inch touchdisplays.
7.0 inch Touch Panel with Capacitive Touch based Myon CPU modules: Myon I with Qualcomm Snapdragon 410E Cortex A53 Quadcore, Myon II with NXP i.MX 8M Mini Cortex A53 Quadcore or Myon II Nano with NXP i.MX 8M Nano.
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Front- and Backside
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7.0 inch Touch Panel with Capacitive Touch based on Trizeps SODIMM 200 CPU modules: Trizeps VII with NXP i.MX 6 Cortex A9 Solo/DualLite/Dual/Quad, Trizeps VIII with NXP i.MX 8M, Trizeps VIII Mini with NXP i.MX 8M Mini, Trizeps VIII Nano with NXP i.MX 8M Nano.
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Front- and Backside
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10.1 inch Touch Panel with Capacitive Touch based on Trizeps SODIMM 200 CPU modules: Trizeps VII with NXP i.MX 6 Cortex A9 Solo/DualLite/Dual/Quad, Trizeps VIII with NXP i.MX 8M, Trizeps VIII Mini with NXP i.MX 8M Mini, Trizeps VIII Nano with NXP i.MX 8M Nano.
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Front- and Backside
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10.1 inch Build-in Industrial PanelPC solution based on Trizeps SODIMM 200 CPU modules: Trizeps VII with NXP i.MX 6 Cortex A9 Solo/DualLite/Dual/Quad, Trizeps VIII with NXP i.MX 8M, Trizeps VIII Mini with NXP i.MX 8M Mini, Trizeps VIII Nano with NXP i.MX 8M Nano.
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ConXT Baseboard
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